New round plastic enclosures for IoT and Industry 4.0 electronics

ROLEC has launched technoDISC – a unique round plastic enclosure for industrial electronics. It is based on the firm’s successful aluDISC diecast aluminum housings. The new technoDISC cases are UV-stable and sealed to IP 66 (IP 67 optional), making them ideal for Industry 4.0 and IoT applications both indoors and outside.

These ‘go anywhere’ enclosures can be fitted to walls, bulkheads, machines – even when closed (protecting the seal and electronics during installation). Clip-on POM (polyoxymethylene) trims cover all the fixing and mounting screws.

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